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We are experienced with a diverse mix of RF manufacturing technologies, including:

• Wire-bonded MMIC die with microstrip on quartz or soft-board (typically used above 18 GHz)
• Surface mount packaged MMICs on microstrip or co-planar guide, on alumina or soft-board (typically used for 1 – 18 GHz)
• Surface mount packaged ICs on multi-layer FR-4 (DC – 1 GHz)

Production volume, cost, reliability, and performance are the prime drivers of optimum technology choice.